Capacitive and Inductive TSV-to-TSV Resilient Approaches for 3D ICs

Pooria M. Yaghini, Ashkan Eghbal, Siavash S. Yazdi, Nader Bagherzadeh, Michael M. Green. Capacitive and Inductive TSV-to-TSV Resilient Approaches for 3D ICs. IEEE Transactions on Computers, 65(3):693-705, 2016. [doi]

Abstract

Abstract is missing.