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Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device

Y. Yamada, Y. Takaku, Y. Yagi, I. Nakagawa, T. Atsumi, M. Shirai, I. Ohnuma, K. Ishida. Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device. Microelectronics Reliability, 47(12):2147-2151, 2007. [doi]

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Y. Yamada

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Y. Takaku

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Y. Yagi

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I. Nakagawa

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T. Atsumi

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M. Shirai

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I. Ohnuma

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K. Ishida

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