Y. Yamada, Y. Takaku, Y. Yagi, I. Nakagawa, T. Atsumi, M. Shirai, I. Ohnuma, K. Ishida. Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device. Microelectronics Reliability, 47(12):2147-2151, 2007. [doi]
@article{YamadaTYNASOI07,
title = {Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device},
author = {Y. Yamada and Y. Takaku and Y. Yagi and I. Nakagawa and T. Atsumi and M. Shirai and I. Ohnuma and K. Ishida},
year = {2007},
doi = {10.1016/j.microrel.2007.07.102},
url = {http://dx.doi.org/10.1016/j.microrel.2007.07.102},
tags = {reliability},
researchr = {https://researchr.org/publication/YamadaTYNASOI07},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {47},
number = {12},
pages = {2147-2151},
}