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Yasushi Yamada, Yoshikazu Takaku, Yuji Yagi, Y. Nishibe, I. Ohnuma, Y. Sutou, R. Kainuma, K. Ishida. Pb-free high temperature solders for power device packaging. Microelectronics Reliability, 46(9-11):1932-1937, 2006. [doi]
Abstract is missing.