Michitaka Yamamoto, Seiichi Takamatsu, Toshihiro Itoh. Stretchable Microscale Patterned Interconnects Formed on Micro-Corrugated Vertical Wavy Structured Substrate. In 2023 IEEE SENSORS, Vienna, Austria, October 29 - Nov. 1, 2023. pages 1-4, IEEE, 2023. [doi]
@inproceedings{YamamotoTI23,
title = {Stretchable Microscale Patterned Interconnects Formed on Micro-Corrugated Vertical Wavy Structured Substrate},
author = {Michitaka Yamamoto and Seiichi Takamatsu and Toshihiro Itoh},
year = {2023},
doi = {10.1109/SENSORS56945.2023.10324865},
url = {https://doi.org/10.1109/SENSORS56945.2023.10324865},
researchr = {https://researchr.org/publication/YamamotoTI23},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {2023 IEEE SENSORS, Vienna, Austria, October 29 - Nov. 1, 2023},
publisher = {IEEE},
isbn = {979-8-3503-0387-2},
}