Michitaka Yamamoto, Seiichi Takamatsu, Toshihiro Itoh. Stretchable Microscale Patterned Interconnects Formed on Micro-Corrugated Vertical Wavy Structured Substrate. In 2023 IEEE SENSORS, Vienna, Austria, October 29 - Nov. 1, 2023. pages 1-4, IEEE, 2023. [doi]
Abstract is missing.