Jin-Tai Yan, Yu-Cheng Chang, Zhi-Wei Chen. Thermal via planning for temperature reduction in 3D ICs. In Thomas Büchner, Ramalingam Sridhar, Andrew Marshall, Norbert Schuhmann, editors, Annual IEEE International SoC Conference, SoCC 2010, September 27-29, 2010, Las Vegas, NV, USA, Proceedings. pages 392-395, IEEE, 2010. [doi]
@inproceedings{YanCC10a,
title = {Thermal via planning for temperature reduction in 3D ICs},
author = {Jin-Tai Yan and Yu-Cheng Chang and Zhi-Wei Chen},
year = {2010},
doi = {10.1109/SOCC.2010.5784703},
url = {http://dx.doi.org/10.1109/SOCC.2010.5784703},
researchr = {https://researchr.org/publication/YanCC10a},
cites = {0},
citedby = {0},
pages = {392-395},
booktitle = {Annual IEEE International SoC Conference, SoCC 2010, September 27-29, 2010, Las Vegas, NV, USA, Proceedings},
editor = {Thomas Büchner and Ramalingam Sridhar and Andrew Marshall and Norbert Schuhmann},
publisher = {IEEE},
isbn = {978-1-4244-6682-5},
}