Achieving Last-Mile Functional Coverage in Testing Chip Design Software Implementations

Ming Yan, Junjie Chen 0003, Hangyu Mao, Jiajun Jiang, Jianye Hao, Xingjian Li, Zhao Tian, Zhichao Chen, Dong Li 0030, Zhangkong Xian, Yanwei Guo, Wulong Liu, Bin Wang, Yuefeng Sun, Yongshun Cui. Achieving Last-Mile Functional Coverage in Testing Chip Design Software Implementations. In 45th IEEE/ACM International Conference on Software Engineering: Software Engineering in Practice, SEIP@ICSE 2023, Melbourne, Australia, May 14-20, 2023. pages 343-354, IEEE, 2023. [doi]

Authors

Ming Yan

This author has not been identified. Look up 'Ming Yan' in Google

Junjie Chen 0003

This author has not been identified. Look up 'Junjie Chen 0003' in Google

Hangyu Mao

This author has not been identified. Look up 'Hangyu Mao' in Google

Jiajun Jiang

This author has not been identified. Look up 'Jiajun Jiang' in Google

Jianye Hao

This author has not been identified. Look up 'Jianye Hao' in Google

Xingjian Li

This author has not been identified. Look up 'Xingjian Li' in Google

Zhao Tian

This author has not been identified. Look up 'Zhao Tian' in Google

Zhichao Chen

This author has not been identified. Look up 'Zhichao Chen' in Google

Dong Li 0030

This author has not been identified. Look up 'Dong Li 0030' in Google

Zhangkong Xian

This author has not been identified. Look up 'Zhangkong Xian' in Google

Yanwei Guo

This author has not been identified. Look up 'Yanwei Guo' in Google

Wulong Liu

This author has not been identified. Look up 'Wulong Liu' in Google

Bin Wang

This author has not been identified. Look up 'Bin Wang' in Google

Yuefeng Sun

This author has not been identified. Look up 'Yuefeng Sun' in Google

Yongshun Cui

This author has not been identified. Look up 'Yongshun Cui' in Google