Ming Yan, Junjie Chen 0003, Hangyu Mao, Jiajun Jiang, Jianye Hao, Xingjian Li, Zhao Tian, Zhichao Chen, Dong Li 0030, Zhangkong Xian, Yanwei Guo, Wulong Liu, Bin Wang, Yuefeng Sun, Yongshun Cui. Achieving Last-Mile Functional Coverage in Testing Chip Design Software Implementations. In 45th IEEE/ACM International Conference on Software Engineering: Software Engineering in Practice, SEIP@ICSE 2023, Melbourne, Australia, May 14-20, 2023. pages 343-354, IEEE, 2023. [doi]
Abstract is missing.