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Efficient micro-bump assignment for RDL routing in 3DICs

Jin-Tai Yan, Yu-Jen Tseng, Chia-Heng Yen. Efficient micro-bump assignment for RDL routing in 3DICs. In 21st IEEE International Conference on Electronics, Circuits and Systems, ICECS 2014, Marseille, France, December 7-10, 2014. pages 195-198, IEEE, 2014. [doi]

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Jin-Tai Yan

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Yu-Jen Tseng

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Chia-Heng Yen

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