Jin-Tai Yan, Yu-Jen Tseng, Chia-Heng Yen. Efficient micro-bump assignment for RDL routing in 3DICs. In 21st IEEE International Conference on Electronics, Circuits and Systems, ICECS 2014, Marseille, France, December 7-10, 2014. pages 195-198, IEEE, 2014. [doi]
@inproceedings{YanTY14-0,
title = {Efficient micro-bump assignment for RDL routing in 3DICs},
author = {Jin-Tai Yan and Yu-Jen Tseng and Chia-Heng Yen},
year = {2014},
doi = {10.1109/ICECS.2014.7049955},
url = {http://dx.doi.org/10.1109/ICECS.2014.7049955},
researchr = {https://researchr.org/publication/YanTY14-0},
cites = {0},
citedby = {0},
pages = {195-198},
booktitle = {21st IEEE International Conference on Electronics, Circuits and Systems, ICECS 2014, Marseille, France, December 7-10, 2014},
publisher = {IEEE},
isbn = {978-1-4799-4242-8},
}