Jin-Tai Yan, Chia-Heng Yen. Feasible Assignment of Micro-Bumps in 3D ICs. In 16th IEEE International New Circuits and Systems Conference, NEWCAS 2018, Montréal, QC, Canada, June 24-27, 2018. pages 296-299, IEEE, 2018. [doi]
@inproceedings{YanY18-1,
title = {Feasible Assignment of Micro-Bumps in 3D ICs},
author = {Jin-Tai Yan and Chia-Heng Yen},
year = {2018},
doi = {10.1109/NEWCAS.2018.8585566},
url = {https://doi.org/10.1109/NEWCAS.2018.8585566},
researchr = {https://researchr.org/publication/YanY18-1},
cites = {0},
citedby = {0},
pages = {296-299},
booktitle = {16th IEEE International New Circuits and Systems Conference, NEWCAS 2018, Montréal, QC, Canada, June 24-27, 2018},
publisher = {IEEE},
isbn = {978-1-5386-4859-9},
}