3D sensors for the rest of us

Larry Yang. 3D sensors for the rest of us. In 2016 IEEE Hot Chips 28 Symposium (HCS), Cupertino, CA, USA, August 21-23, 2016. pages 1-14, IEEE, 2016. [doi]

@inproceedings{Yang16-66,
  title = {3D sensors for the rest of us},
  author = {Larry Yang},
  year = {2016},
  doi = {10.1109/HOTCHIPS.2016.7936194},
  url = {https://doi.org/10.1109/HOTCHIPS.2016.7936194},
  researchr = {https://researchr.org/publication/Yang16-66},
  cites = {0},
  citedby = {0},
  pages = {1-14},
  booktitle = {2016 IEEE Hot Chips 28 Symposium (HCS), Cupertino, CA, USA, August 21-23, 2016},
  publisher = {IEEE},
  isbn = {978-1-5090-6208-9},
}