Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures

Yu Yang, Hugo Bender, Kai Arstila, Bart Swinnen, Bert Verlinden, Ingrid De Wolf. Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures. Microelectronics Reliability, 48(8-9):1517-1520, 2008. [doi]

@article{YangBASVW08,
  title = {Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures},
  author = {Yu Yang and Hugo Bender and Kai Arstila and Bart Swinnen and Bert Verlinden and Ingrid De Wolf},
  year = {2008},
  doi = {10.1016/j.microrel.2008.06.036},
  url = {http://dx.doi.org/10.1016/j.microrel.2008.06.036},
  researchr = {https://researchr.org/publication/YangBASVW08},
  cites = {0},
  citedby = {0},
  journal = {Microelectronics Reliability},
  volume = {48},
  number = {8-9},
  pages = {1517-1520},
}