Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures

Yu Yang, Hugo Bender, Kai Arstila, Bart Swinnen, Bert Verlinden, Ingrid De Wolf. Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures. Microelectronics Reliability, 48(8-9):1517-1520, 2008. [doi]

Abstract

Abstract is missing.