An automated ultrasonic inspection approach for flip chip solder joint assessment

Ryan S. H. Yang, Derek R. Braden, Guang-Ming Zhang, David M. Harvey. An automated ultrasonic inspection approach for flip chip solder joint assessment. Microelectronics Reliability, 52(12):2995-3001, 2012. [doi]

Authors

Ryan S. H. Yang

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Derek R. Braden

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Guang-Ming Zhang

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David M. Harvey

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