Ryan S. H. Yang, Derek R. Braden, Guang-Ming Zhang, David M. Harvey. An automated ultrasonic inspection approach for flip chip solder joint assessment. Microelectronics Reliability, 52(12):2995-3001, 2012. [doi]
@article{YangBZH12,
title = {An automated ultrasonic inspection approach for flip chip solder joint assessment},
author = {Ryan S. H. Yang and Derek R. Braden and Guang-Ming Zhang and David M. Harvey},
year = {2012},
doi = {10.1016/j.microrel.2012.07.018},
url = {http://dx.doi.org/10.1016/j.microrel.2012.07.018},
researchr = {https://researchr.org/publication/YangBZH12},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {52},
number = {12},
pages = {2995-3001},
}