Huan Yang, Xiaole Cui, Chen Wei, Juncheng Pu, Zhaohong Lin, Xing Zhang. A Joint Data Transmission Scheme With Improved CAC for 3D-SICs Based on Multiple TSV Subarrays. IEEE Trans. on CAD of Integrated Circuits and Systems, 45(4):1611-1624, April 2026. [doi]
@article{YangCWPLZ26,
title = {A Joint Data Transmission Scheme With Improved CAC for 3D-SICs Based on Multiple TSV Subarrays},
author = {Huan Yang and Xiaole Cui and Chen Wei and Juncheng Pu and Zhaohong Lin and Xing Zhang},
year = {2026},
month = {April},
doi = {10.1109/TCAD.2025.3607139},
url = {https://doi.org/10.1109/TCAD.2025.3607139},
researchr = {https://researchr.org/publication/YangCWPLZ26},
cites = {0},
citedby = {0},
journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
volume = {45},
number = {4},
pages = {1611-1624},
}