Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach

Dao-Guo Yang, J. S. Liang, Quan-Yong Li, Leo J. Ernst, G. Q. Zhang. Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach. Microelectronics Reliability, 44(12):1947-1955, 2004. [doi]

Abstract

Abstract is missing.