Hui Yang, Zhengbang Zhan. Cycle thermal simulation of nano silver paste based on Anand model. In Alfonso Farina, Desineni Subbaram Naidu, Otilia Manta, Roberto Sabatini, editors, ICIIP 2021: 2021 6th International Conference on Intelligent Information Processing, Bucharest, Romania, July 29-31, 2021. pages 158-161, ACM, 2021. [doi]
Abstract is missing.