Yizhou Ye, Zhenjun Wang, Zhenxiang Yi, Ming Qin, Qing-An Huang. Annular-Encapsulation Packaging to Realize High-Performance MEMS Thermal Wind Sensor. In 13th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2018, Singapore, Singapore, April 22-26, 2018. pages 456-459, IEEE, 2018. [doi]
@inproceedings{YeWYQH18,
title = {Annular-Encapsulation Packaging to Realize High-Performance MEMS Thermal Wind Sensor},
author = {Yizhou Ye and Zhenjun Wang and Zhenxiang Yi and Ming Qin and Qing-An Huang},
year = {2018},
doi = {10.1109/NEMS.2018.8557002},
url = {https://doi.org/10.1109/NEMS.2018.8557002},
researchr = {https://researchr.org/publication/YeWYQH18},
cites = {0},
citedby = {0},
pages = {456-459},
booktitle = {13th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2018, Singapore, Singapore, April 22-26, 2018},
publisher = {IEEE},
isbn = {978-1-5386-5273-2},
}