Yizhou Ye, Zhenjun Wang, Zhenxiang Yi, Ming Qin, Qing-An Huang. Annular-Encapsulation Packaging to Realize High-Performance MEMS Thermal Wind Sensor. In 13th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2018, Singapore, Singapore, April 22-26, 2018. pages 456-459, IEEE, 2018. [doi]
Abstract is missing.