Temperature-Insensitive Soft-Error-Tolerant Flip-Flop Design For Automotive Electronics

Ralf E.-H. Yee, Nicholas Y.-J. Su, Lowry P.-T. Wang, Charles H.-P. Wen, Herming Chiueh. Temperature-Insensitive Soft-Error-Tolerant Flip-Flop Design For Automotive Electronics. In 42nd IEEE VLSI Test Symposium, VTS 2024, Tempe, AZ, USA, April 22-24, 2024. pages 1-7, IEEE, 2024. [doi]

@inproceedings{YeeSWWC24,
  title = {Temperature-Insensitive Soft-Error-Tolerant Flip-Flop Design For Automotive Electronics},
  author = {Ralf E.-H. Yee and Nicholas Y.-J. Su and Lowry P.-T. Wang and Charles H.-P. Wen and Herming Chiueh},
  year = {2024},
  doi = {10.1109/VTS60656.2024.10538664},
  url = {https://doi.org/10.1109/VTS60656.2024.10538664},
  researchr = {https://researchr.org/publication/YeeSWWC24},
  cites = {0},
  citedby = {0},
  pages = {1-7},
  booktitle = {42nd IEEE VLSI Test Symposium, VTS 2024, Tempe, AZ, USA, April 22-24, 2024},
  publisher = {IEEE},
  isbn = {979-8-3503-6378-4},
}