Chang-Lin Yeh, Yi-Shao Lai. Transient analysis of the impact stage of wirebonding on Cu/low-K wafers. Microelectronics Reliability, 45(2):371-378, 2005. [doi]
@article{YehL05-0,
title = {Transient analysis of the impact stage of wirebonding on Cu/low-K wafers},
author = {Chang-Lin Yeh and Yi-Shao Lai},
year = {2005},
doi = {10.1016/j.microrel.2004.04.026},
url = {http://dx.doi.org/10.1016/j.microrel.2004.04.026},
tags = {analysis},
researchr = {https://researchr.org/publication/YehL05-0},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {45},
number = {2},
pages = {371-378},
}