Consideration of temperature and current stress testing on flip chip solder interconnects

Alfred Yeo, Bernd Ebersberger, Charles Lee. Consideration of temperature and current stress testing on flip chip solder interconnects. Microelectronics Reliability, 48(11-12):1847-1856, 2008. [doi]

Authors

Alfred Yeo

This author has not been identified. Look up 'Alfred Yeo' in Google

Bernd Ebersberger

This author has not been identified. Look up 'Bernd Ebersberger' in Google

Charles Lee

This author has not been identified. Look up 'Charles Lee' in Google