Alfred Yeo, Bernd Ebersberger, Charles Lee. Consideration of temperature and current stress testing on flip chip solder interconnects. Microelectronics Reliability, 48(11-12):1847-1856, 2008. [doi]
@article{YeoEL08,
title = {Consideration of temperature and current stress testing on flip chip solder interconnects},
author = {Alfred Yeo and Bernd Ebersberger and Charles Lee},
year = {2008},
doi = {10.1016/j.microrel.2008.07.070},
url = {http://dx.doi.org/10.1016/j.microrel.2008.07.070},
tags = {testing},
researchr = {https://researchr.org/publication/YeoEL08},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {48},
number = {11-12},
pages = {1847-1856},
}