Siang Miang Yeo, Ho Kwang Yow, Keat Hoe Yeoh, Siti Nur Farhana Mohamad Azenal. Elimination of Die-Pop Defect by Vacuum Reflow for Ultrathin Die With Warpage in Semiconductor Packaging Assembly. IEEE Transactions on Reliability, 73(1):784-791, March 2024. [doi]
Abstract is missing.