Elimination of Die-Pop Defect by Vacuum Reflow for Ultrathin Die With Warpage in Semiconductor Packaging Assembly

Siang Miang Yeo, Ho Kwang Yow, Keat Hoe Yeoh, Siti Nur Farhana Mohamad Azenal. Elimination of Die-Pop Defect by Vacuum Reflow for Ultrathin Die With Warpage in Semiconductor Packaging Assembly. IEEE Transactions on Reliability, 73(1):784-791, March 2024. [doi]

Abstract

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