Thermal Study for High-Photocurrent Photodetector in Non-Saturation Region Using Thin Substrate, Thin Absorber, and Flip- Chip Bonding Process

Yaofeng Yi, Toshimasa Umezawa, Kouichi Akahane, Tetsuya Kawanishi. Thermal Study for High-Photocurrent Photodetector in Non-Saturation Region Using Thin Substrate, Thin Absorber, and Flip- Chip Bonding Process. IEEE Access, 12:56414-56421, 2024. [doi]

Abstract

Abstract is missing.