Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging

Byung-seung Yim, Yumi Kwon, Seung-Hoon Oh, Jooheon Kim, Yong-Eui Shin, Seong Hyuk Lee, Jongmin Kim. Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging. Microelectronics Reliability, 52(6):1165-1173, 2012. [doi]

Abstract

Abstract is missing.