An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler

Byung-seung Yim, Jeong-Il Lee, Byung-Hun Lee, Young-Eui Shin, Jong-Min Kim. An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler. Microelectronics Reliability, 54(12):2944-2950, 2014. [doi]

Abstract

Abstract is missing.