Thermal-uniformity-aware X-filling to reduce temperature-induced delay variation for accurate at-speed testing - researchr publication authors

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Tomokazu Yoneda, Michiko Inoue, Yasuo Sato, Hideo Fujiwara. Thermal-uniformity-aware X-filling to reduce temperature-induced delay variation for accurate at-speed testing. In 28th IEEE VLSI Test Symposium, VTS 2010, April 19-22, 2010, Santa Cruz, California, USA. pages 188-193, IEEE Computer Society, 2010. [doi]

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