Tomokazu Yoneda, Michiko Inoue, Yasuo Sato, Hideo Fujiwara. Thermal-uniformity-aware X-filling to reduce temperature-induced delay variation for accurate at-speed testing. In 28th IEEE VLSI Test Symposium, VTS 2010, April 19-22, 2010, Santa Cruz, California, USA. pages 188-193, IEEE Computer Society, 2010. [doi]
@inproceedings{YonedaISF10,
title = {Thermal-uniformity-aware X-filling to reduce temperature-induced delay variation for accurate at-speed testing},
author = {Tomokazu Yoneda and Michiko Inoue and Yasuo Sato and Hideo Fujiwara},
year = {2010},
doi = {10.1109/VTS.2010.5469578},
url = {http://dx.doi.org/10.1109/VTS.2010.5469578},
tags = {testing, context-aware},
researchr = {https://researchr.org/publication/YonedaISF10},
cites = {0},
citedby = {0},
pages = {188-193},
booktitle = {28th IEEE VLSI Test Symposium, VTS 2010, April 19-22, 2010, Santa Cruz, California, USA},
publisher = {IEEE Computer Society},
isbn = {978-1-4244-6648-1},
}