Satoshi Yoshida, Shoichi Tanifuji, Suguru Kameda, Noriharu Suematsu, Tadashi Takagi, Kazuo Tsubouchi. 60-GHz Band Copper Ball Vertical Interconnection for MMW 3-D System-in-Package Front-End Modules. IEICE Transactions, 95-C(7):1276-1284, 2012. [doi]
@article{YoshidaTKSTT12,
title = {60-GHz Band Copper Ball Vertical Interconnection for MMW 3-D System-in-Package Front-End Modules},
author = {Satoshi Yoshida and Shoichi Tanifuji and Suguru Kameda and Noriharu Suematsu and Tadashi Takagi and Kazuo Tsubouchi},
year = {2012},
url = {http://search.ieice.org/bin/summary.php?id=e95-c_7_1276},
researchr = {https://researchr.org/publication/YoshidaTKSTT12},
cites = {0},
citedby = {0},
journal = {IEICE Transactions},
volume = {95-C},
number = {7},
pages = {1276-1284},
}