60-GHz Band Copper Ball Vertical Interconnection for MMW 3-D System-in-Package Front-End Modules

Satoshi Yoshida, Shoichi Tanifuji, Suguru Kameda, Noriharu Suematsu, Tadashi Takagi, Kazuo Tsubouchi. 60-GHz Band Copper Ball Vertical Interconnection for MMW 3-D System-in-Package Front-End Modules. IEICE Transactions, 95-C(7):1276-1284, 2012. [doi]

Abstract

Abstract is missing.