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Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging

Chen Yu, Shaocheng Wu, Yi Zhong, Rongbin Xu, Tian Yu, Jin Zhao, Daquan Yu. Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging. Sensors, 24(1):171, 2024. [doi]

Authors

Chen Yu

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Shaocheng Wu

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Yi Zhong

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Rongbin Xu

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Tian Yu

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Jin Zhao

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Daquan Yu

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