Chen Yu, Shaocheng Wu, Yi Zhong, Rongbin Xu, Tian Yu, Jin Zhao, Daquan Yu. Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging. Sensors, 24(1):171, 2024. [doi]
@article{YuWZXYZY24,
title = {Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging},
author = {Chen Yu and Shaocheng Wu and Yi Zhong and Rongbin Xu and Tian Yu and Jin Zhao and Daquan Yu},
year = {2024},
doi = {10.3390/s24010171},
url = {https://doi.org/10.3390/s24010171},
researchr = {https://researchr.org/publication/YuWZXYZY24},
cites = {0},
citedby = {0},
journal = {Sensors},
volume = {24},
number = {1},
pages = {171},
}