Performance evaluation of air-gap-based coaxial RF TSV for 3D NoC

Le Yu, Haigang Yang, Jia Zhang, Wei Wang. Performance evaluation of air-gap-based coaxial RF TSV for 3D NoC. In IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011, Kowloon, Hong Kong, China, October 3-5, 2011. pages 94-97, IEEE, 2011. [doi]

Abstract

Abstract is missing.