Fast 3-D Thermal Simulation for Integrated Circuits With Domain Decomposition Method

Wenjian Yu, Tao Zhang, Xiaolong Yuan, Haifeng Qian. Fast 3-D Thermal Simulation for Integrated Circuits With Domain Decomposition Method. IEEE Trans. on CAD of Integrated Circuits and Systems, 32(12):2014-2018, 2013. [doi]

@article{YuZYQ13,
  title = {Fast 3-D Thermal Simulation for Integrated Circuits With Domain Decomposition Method},
  author = {Wenjian Yu and Tao Zhang and Xiaolong Yuan and Haifeng Qian},
  year = {2013},
  doi = {10.1109/TCAD.2013.2273987},
  url = {http://dx.doi.org/10.1109/TCAD.2013.2273987},
  researchr = {https://researchr.org/publication/YuZYQ13},
  cites = {0},
  citedby = {0},
  journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
  volume = {32},
  number = {12},
  pages = {2014-2018},
}