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Impact of ground solder ball failure in BGA package on near electric field radiation

Yidong Yuan, Tianmeng Zhang, Ziren Wang, Kaixuan Song, Lingyu Bi, Lu Tian, Jinchun Gao. Impact of ground solder ball failure in BGA package on near electric field radiation. IEICE Electronic Express, 19(17):20220313, 2022. [doi]

Authors

Yidong Yuan

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Tianmeng Zhang

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Ziren Wang

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Kaixuan Song

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Lingyu Bi

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Lu Tian

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Jinchun Gao

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