A 5.6-89.9TOPS/W Heterogeneous Computing-in-Memory SoC with High-Utilization Producer-Consumer Architecture and High-Frequency Read-Free CIM Macro

Jinshan Yue, Mingtao Zhan, Zi Wang, Yifan He, Yaolei Li, Songming Yu, Wenyu Sun, Lu Jie, Chunmeng Dou, Xueqing Li, Nan Sun, Huazhong Yang, Ming Liu, Yongpan Liu. A 5.6-89.9TOPS/W Heterogeneous Computing-in-Memory SoC with High-Utilization Producer-Consumer Architecture and High-Frequency Read-Free CIM Macro. In 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Kyoto, Japan, June 11-16, 2023. pages 1-2, IEEE, 2023. [doi]

@inproceedings{YueZWHLYSJDLSYL23,
  title = {A 5.6-89.9TOPS/W Heterogeneous Computing-in-Memory SoC with High-Utilization Producer-Consumer Architecture and High-Frequency Read-Free CIM Macro},
  author = {Jinshan Yue and Mingtao Zhan and Zi Wang and Yifan He and Yaolei Li and Songming Yu and Wenyu Sun and Lu Jie and Chunmeng Dou and Xueqing Li and Nan Sun and Huazhong Yang and Ming Liu and Yongpan Liu},
  year = {2023},
  doi = {10.23919/VLSITechnologyandCir57934.2023.10185315},
  url = {https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185315},
  researchr = {https://researchr.org/publication/YueZWHLYSJDLSYL23},
  cites = {0},
  citedby = {0},
  pages = {1-2},
  booktitle = {2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Kyoto, Japan, June 11-16, 2023},
  publisher = {IEEE},
  isbn = {978-4-86348-806-9},
}