J. J. M. Zaal, W. D. van Driel, S. Bendida, Q. Li, J. T. M. van Beek, G. Q. Zhang. Packaging influences on the reliability of MEMS resonators. Microelectronics Reliability, 48(8-9):1567-1571, 2008. [doi]
@article{ZaalDBLBZ08,
title = {Packaging influences on the reliability of MEMS resonators},
author = {J. J. M. Zaal and W. D. van Driel and S. Bendida and Q. Li and J. T. M. van Beek and G. Q. Zhang},
year = {2008},
doi = {10.1016/j.microrel.2008.06.041},
url = {http://dx.doi.org/10.1016/j.microrel.2008.06.041},
tags = {reliability},
researchr = {https://researchr.org/publication/ZaalDBLBZ08},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {48},
number = {8-9},
pages = {1567-1571},
}