J. J. M. Zaal, Hendrik Pieter Hochstenbach, Willem D. van Driel, G. Q. Zhang. Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull. Microelectronics Reliability, 49(8):846-852, 2009. [doi]
@article{ZaalHDZ09,
title = {Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull},
author = {J. J. M. Zaal and Hendrik Pieter Hochstenbach and Willem D. van Driel and G. Q. Zhang},
year = {2009},
doi = {10.1016/j.microrel.2009.03.008},
url = {http://dx.doi.org/10.1016/j.microrel.2009.03.008},
tags = {reliability},
researchr = {https://researchr.org/publication/ZaalHDZ09},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {49},
number = {8},
pages = {846-852},
}