Investigation of localized thermal vias for temperature reduction in 3D multicore processors

Piotr Zajac, Melvin Galicia, Cezary Maj, Andrzej Napieralski. Investigation of localized thermal vias for temperature reduction in 3D multicore processors. In 22nd International Conference Mixed Design of Integrated Circuits & Systems, MIXDES 2015, Torun, Poland, June 25-27, 2015. pages 426-430, IEEE, 2015. [doi]

Abstract

Abstract is missing.