Thermal-aware Floorplanning Guidelines for 3D ICs with Integrated Microchannels - researchr publication authors

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Piotr Zajac, Melvin Galicia, Andrzej Napieralski. Thermal-aware Floorplanning Guidelines for 3D ICs with Integrated Microchannels. In 25th International Conference "Mixed Design of Integrated Circuits and System", MIXDES 2018, Gdynia, Poland, June 21-23, 2018. pages 258-261, IEEE, 2018. [doi]

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