Piotr Zajac, Melvin Galicia, Andrzej Napieralski. Thermal-aware Floorplanning Guidelines for 3D ICs with Integrated Microchannels. In 25th International Conference "Mixed Design of Integrated Circuits and System", MIXDES 2018, Gdynia, Poland, June 21-23, 2018. pages 258-261, IEEE, 2018. [doi]
@inproceedings{ZajacGN18,
title = {Thermal-aware Floorplanning Guidelines for 3D ICs with Integrated Microchannels},
author = {Piotr Zajac and Melvin Galicia and Andrzej Napieralski},
year = {2018},
doi = {10.23919/MIXDES.2018.8436886},
url = {https://doi.org/10.23919/MIXDES.2018.8436886},
researchr = {https://researchr.org/publication/ZajacGN18},
cites = {0},
citedby = {0},
pages = {258-261},
booktitle = {25th International Conference "Mixed Design of Integrated Circuits and System", MIXDES 2018, Gdynia, Poland, June 21-23, 2018},
publisher = {IEEE},
isbn = {978-83-63578-14-5},
}