Thermodynamic study on the corrosion mechanism of copper wire bonding

YingZhi Zeng, Kewu Bai, Hongmei Jin. Thermodynamic study on the corrosion mechanism of copper wire bonding. Microelectronics Reliability, 53(7):985-1001, 2013. [doi]

Authors

YingZhi Zeng

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Kewu Bai

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Hongmei Jin

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