YingZhi Zeng, Kewu Bai, Hongmei Jin. Thermodynamic study on the corrosion mechanism of copper wire bonding. Microelectronics Reliability, 53(7):985-1001, 2013. [doi]
@article{ZengBJ13,
title = {Thermodynamic study on the corrosion mechanism of copper wire bonding},
author = {YingZhi Zeng and Kewu Bai and Hongmei Jin},
year = {2013},
doi = {10.1016/j.microrel.2013.03.006},
url = {http://dx.doi.org/10.1016/j.microrel.2013.03.006},
researchr = {https://researchr.org/publication/ZengBJ13},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {53},
number = {7},
pages = {985-1001},
}