Yan-hua Zeng, Yun-xia Fu, Dong-mei Tang, Yi-qing Zhu. Standard measuring device for thickness of silicon wafer based on laser compensation system. In 4th International Conference on Systems and Informatics, ICSAI 2017, Hangzhou, China, November 11-13, 2017. pages 1733-1737, IEEE, 2017. [doi]
@inproceedings{ZengFTZ17,
title = {Standard measuring device for thickness of silicon wafer based on laser compensation system},
author = {Yan-hua Zeng and Yun-xia Fu and Dong-mei Tang and Yi-qing Zhu},
year = {2017},
doi = {10.1109/ICSAI.2017.8248564},
url = {https://doi.org/10.1109/ICSAI.2017.8248564},
researchr = {https://researchr.org/publication/ZengFTZ17},
cites = {0},
citedby = {0},
pages = {1733-1737},
booktitle = {4th International Conference on Systems and Informatics, ICSAI 2017, Hangzhou, China, November 11-13, 2017},
publisher = {IEEE},
isbn = {978-1-5386-1107-4},
}