Yan-hua Zeng, Yun-xia Fu, Dong-mei Tang, Yi-qing Zhu. Standard measuring device for thickness of silicon wafer based on laser compensation system. In 4th International Conference on Systems and Informatics, ICSAI 2017, Hangzhou, China, November 11-13, 2017. pages 1733-1737, IEEE, 2017. [doi]
Abstract is missing.