Wenjiang Zeng, Huamao Lin, Xiaolin Zhang, Ramasamy Chockalingam, Wee Chong Heng, Sangki Hong, Narayanan Balasubramanian. Effects Of Wafer Bonding And Thinning Processes On Electrical Performance Of Mos Devices. International Journal of Computational Engineering Science, 4(2):323-326, 2003. [doi]
@article{ZengLZCHHB03,
title = {Effects Of Wafer Bonding And Thinning Processes On Electrical Performance Of Mos Devices},
author = {Wenjiang Zeng and Huamao Lin and Xiaolin Zhang and Ramasamy Chockalingam and Wee Chong Heng and Sangki Hong and Narayanan Balasubramanian},
year = {2003},
doi = {10.1142/S1465876303001186},
url = {http://dx.doi.org/10.1142/S1465876303001186},
researchr = {https://researchr.org/publication/ZengLZCHHB03},
cites = {0},
citedby = {0},
journal = {International Journal of Computational Engineering Science},
volume = {4},
number = {2},
pages = {323-326},
}